
Leco 009 BGA reworking table, equipped with optical alignment system

Adopt 27x optical zoom and 12x digital zoom

Preheating table is equipped with four high-quality circuit board support rods

Each machine is equipped with four aluminum alloy support rods for placing the circuit board
Support rods can move smoothly from front to back
The four small sliders on each support can move smoothly from left to right
Install a support screw on each small slider
Support nail tip always horizontal
The circuit board will not be raised or concave
Strong guarantee: never deformed

Processed on the support rod“T”Groove
The slider can be followed“T”Smooth movement of the groove left and right
Easily avoid components
For example, a laptop has many components on both sides
This support structure is especially suitable
Threaded at the bottom of the screw
Turning the screw can change the height of the support point
Screw tip support point diameter 0.25mm
Will not scrape the circuit board

The heating bricks that are not needed for the time being can be turned off separately

Highlight the lighting to ensure sufficient light

The air nozzle is adsorbed on the heating head with a magnet and can rotate at will at will at 360 degrees.

The above picture shows the core components of the BGA repair station—Heater
High-quality heating core structure with reasonable design, fine workmanship, symmetrical and long service life
The temperature is uniform after the air flow passes through the heating core
The wind speed is calm and it is not easy to accumulate dust
After years of use
Performance is still guaranteed
Reco's new BGA rehabilitation Taiwan fully uses imported German materials, with outstanding performance
1. The air outlet is uniform to ensure that the four corners of the chip are melted at the same time
2. Accurate temperature and do not bake chips
3. No need to dry the circuit board and chip before desoldering the chip
4. Extra long service life, 10 years design life
Problems with inferior heating cores:
1.The air outlet is uneven. After soldering, the chip will not melt while soldering.
2.Part of the solder joints after welding
3.After the circuit board is repaired, it will be soldered again in a short time
4.During welding, the chip is bent, bulged, sunken, bubbled, and abnormal sound
5.The circuit board must be dried before welding, otherwise the welding success rate cannot be guaranteed.
6.Short service life, easy to burn, and need to be replaced regularly
Click to view:http://www.bgafx.com/044/044.htm
Comparison of performance of various heating cores...It's so important, I regret it if I don't look at it!

The picture above is the steel net of the wind nozzle
The size of the steel mesh hole is carefully calculated, with the hole in the middle and the hole in the surrounding area large.
This design makes the hot air blown from the air nozzle have a temperature of about 5 degrees lower than the surrounding temperature.
This hot air characteristic is very conducive to protecting the chip and avoiding chip tin short circuit.

High-definition 7-inch touch screen Chinese interface Easy to operate

The screen can display the temperature curve clearly and intuitively
Each temperature zone can be heated in 8 sections. It is powerful
It can store 10,000 sets of temperature curves and ensure that it cannot be used up!!!

The machine is equipped with an electric vacuum suction pen

Our factory users are all over the world
Machine repair and maintenance
Especially remote maintenance
Very important
Based on this
The whole machine design adopts a modular structure
In case of failure
We will express the relevant modules to the user's location
According to the drawings, just simple repair tools are required
Ordinary users can quickly replace modules
The machine can be repaired quickly
This maintenance mode
Very fast and efficient
Working principle of optical alignment system
Through optical system
Implement the BGA chip pad and PCB surface pad simultaneously image on high-definition industrial CCD
The positioning process is observed through the monitor
High-precision linear guides allow precise movement of the mounting head
The station can adjust the X, Y directions and angles at any time
Ensure accurate positioning of BGA chips
Optical alignment technical indicators:
27x optical amplification (F=1.6, F=3.9mm-85.8mm)
12x electronic amplification
Lens magnification can be changed as needed
Operating voltage DC 12V
Imaging device 1/4"SONY CCD
Effective pixel PAL: 782(H)×582(V)S
Signal format PAL format
Video output 1.0VP-P75Ω(BNC)
Focusing system: Automatic focus
Prism size: 60*60mm
Applicable chip: 2mm×2mm-56mm×56mm
Applicable circuit board area: 500×670mm
Patch accuracy:± 10um
Light source: two-color LED lighting, chip parts are made of white LED lighting, PCB pad parts are made of red LED lighting
Minimum illuminance 1.0-0.02Lux
LED light source voltage: 24V
Power: 15W
Automatic focus
Built-in industrial-grade diaphragm pump as gas source
LCD monitor size: 15 inches
BGA rework performance indicators and specification parameters:
This repair desk is suitable for repairing circuit boards such as laptop motherboards, desktop computer motherboards, server motherboards, XBOX-360 and other circuit boards.
The three temperature zones are independently heated, with the upper hot air 800W, the lower hot air 800W, and the lower infrared preheating is 2400W.
The motor controls the movement of the heating head and has high accuracy.
It is equipped with 2 high-light lighting to ensure that the working environment is bright enough.
As a human-computer interface, the 7-inch touch screen displays the temperature curves of three temperature zones in real time.
Accurately control the desoldering temperature, the temperature error is only about 1 degree.
8-section heating + 8-section constant temperature control, 10,000 sets of temperature curves can be stored.
The standard-configured 009 can achieve the ideal welding effect by just a period of heating and a period of constant temperature, which is simple and reliable.
High-power cross-current fan quickly cools the circuit board.
The desoldering function has an acoustic alarm function.
Electric vacuum suction pen to absorb the BGA chip.
The circuit board support structure is reasonable and the welding area will never be concave.
The infrared heating plate can be controlled separately.
The lower part is a preheating table, which is used to ensure that the PCB board does not deform and can preheat a circuit board of 500*670mm.
This repair station is equipped with 6 air nozzles, as large as 775 CPU base and as small as memory particles, and can be soldered.
Exterior dimensions: 690mm long×Width 550mm×Height 600mm.
Power supply: 220V 50/60HZ.
Effective power: 3600W.
Machine weight: 52 kg.
The welding success rate can reach almost 100%



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